PECVD


Plasma Enhanced Vapor Deposition

Description
Full automatic controlon process time, temperature, air flow, valve action, reaction chamber pressure by industrial PC;

  • Imported close-loop pressure control system with high reliability;
  • Imported erosion-proof stainless steel fittings and valves ensuring bubble tight-ness of pneumatic system;
  • Perfect alarm and safe interlock devices;
  • Alarm for over-/less-temperature, MFC, reaction chamber pressure, RF, CDA pressure,N2 pressure and Water flow etc.
  • With SiO2  Film Growth function, which can solve solar module PID problem, at the same time, can used for SiNxOy film growth. Finally makes the cell’s efficiency increased greatly.

Wafer loading qty: 320 pieces/tube (125*125), 252 pieces/tube (156*156)

  • Purification workstation: Class-100(In Class-10000 FAB);
  • Automation degree: Automatic temperature and process control.
  • Wafer load method: Soft-landing, with characteristics: credibility, steady, non-crawling, high anchor precision, long longevity and high carrying capacity.

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